Electronics Manufacturing industries that use fluorocarbon gases for etching and chamber cleaning include liquid crystal displays (LCDs), photovoltaic cells (PV), and semiconductors (including light-emitting diodes). A range of gases are used in two important steps of electronics manufacturing:
(i) plasma etching silicon containing materials and
(ii) cleaning chemical vapour deposition (CVD) tool chamber-walls where silicon has deposited.
The gases include CH2F2 (difluoromethane, HFC-32), PFCs, nitrogen trifluoride (NF3), and sulfur hexafluoride (SF6). The use of fluorocarbon gases in these processes is crucial to the production of devices, as there are no effective substitutes that can be utilized. The majority of FC emissions results from limited utilisation efficiency (i.e., consumption) of the FC precursors during the etching or the cleaning process.Key measures that have contributed to substantially reduce fluorocarbon gas emissions are, among others, installation of dedicated post process tool abatement.
The World Semiconductor Council (WSC) and its affiliated associations, agreed to voluntarily reduce atmospheric emissions of PFCs and information on the progress of this commitment was reported in a 2017 Statement of the 21st Meeting of the World Semiconductor Council (WSC) and its Best Practice Guidance for Semiconductor PFC Emission Reduction sets out technical guidance In order to effectively and efficiently achieve the (WSC) emission voluntary reduction program .